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ShenZhen QingFengYuan Technology Co.,Ltd.
Shenzhen QINGFENGYUAN Technology Co., Ltd. was established in 2013. It is a large-scale professional electronic component distributor with a complete range of products. Products include analog
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Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N

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Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N

Series : SN74H164N, SN74H164N

Description : Integrated circuits

Manufacturer Part Number : SN74H164N

Type : microcontroller

Place of Origin : United States

Manufacturer : TEXAS-INSTRUMENTS

Manufacturing Date Code : Newest

Module/Board Type : STANDARD

Core Processor : STANDARD

Co-Processor : STANDARD

Speed : STANDARD

Flash Size : STANDARD

RAM Size : STANDARD

Connector Type : STANDARD

Size / Dimension : STANDARD

Packaging : STANDARD

Core Size : 32-Bit

Connectivity : CANbus, DCMI, EBI/EMI, Ethernet, CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART

Peripherals : STANDARD

Number of I/O : STANDARD

Program Memory Size : STANDARD

Program Memory Type : STANDARD

Voltage - Supply (Vcc/Vdd) : STANDARD

Data Converters : STANDARD

Oscillator Type : STANDARD

Controller Series : STANDARD

Interface : STANDARD

Voltage - Supply : STANDARD

Package / Case : STANDARD

Number of Cores/Bus Width : STANDARD

Graphics Acceleration : STANDARD

Display & Interface Controllers : STANDARD

USB : STANDARD

Voltage - I/O : STANDARD

Cross Reference : STANDARD

Product Type : Motor / Motion / Ignition Controllers & Drivers

Mounting Type : Surface Mount, Surface Mount

Shipping by : DHL\UPS\Fedex\EMS\HK Post

Product Name : Electronic ic Component IC Chip

Payment ways : Ali Trade Assurance/TT

Brand name : TEXAS-INSTRUMENTS

Quality : 100% NEW ORIGINAL

Service : 24 Hours Online

Package : STANDARD

Operating Temperature : STANDARD

Applications : Industrial, Consumer Electronics

Packaging Details : The goods will be packed in carton which wrapped all by adhesive tape. In order to lower the freight cost, the volumn of the carton will be compressed without hurting the goods.

Port : shenzhen

Supply Ability : 10000 Piece/Pieces per Day

MOQ : 10 pieces

Price : $2.68/pieces 10-99 pieces

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Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Product Paramenters
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
SN74H164N
MSP430 Family: Low-Cost, Low-Power, Versatile Embedded 16-bit MCUs TMS320 Series: 16/32-bit MCU family optimized for real-time control applications 16-bit, whole-point arithmetic, 20 to 40 MHz C28X: 32-bit, integer or floating-point arithmetic, 100 to 150 MHz digital signal processor TMS320 series TMS320C2xxx: 16- and 32-bit digital signal processors optimized for control applications TMS320C5xxx: 16-bit full-point low-power processor, 100 to 300 MHz TMS320C6xxx: High Performance Digital Signal Processor Family, 300 to 1000 Hz Other models include TMS320C33, TMS320C3x, TMS320C4x, TMS320C5x, and TMS320C8x, as well as OMAP series of multi-core processors based on ARM architecture designed for mobile devices, such as ARM9, ARM11, and Cortex-A8.
Manufacturer:
Texas Instruments
Product Category:
Microprocessors - MPU
RoHS:
Details
Mounting Style:
SMD/SMT
Package / Case:
PBGA-324
Series:
AM3352
Core:
ARM Cortex A8
Number of Cores:
1 Core
Data Bus Width:
32 bit
Maximum Clock Frequency:
1 GHz
L1 Cache Instruction Memory:
32 kB
L1 Cache Data Memory:
32 kB
Operating Supply Voltage:
1.325 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Packaging:
Tray
Brand:
Texas Instruments
Data RAM Size:
64 kB, 64 kB
Data ROM Size:
176 kB
Development Kit:
TMDXEVM3358
I/O Voltage:
1.8 V, 3.3 V
Interface Type:
CAN, Ethernet, I2C, SPI, UART, USB
L2 Cache Instruction / Data Memory:
256 kB
Memory Type:
L1/L2/L3 Cache, RAM, ROM
Moisture Sensitive:
Yes
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Our Advantages
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Company Profile
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Recommend Products
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Manufacturing Technique
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N
FAQ
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N

FAQ

Q1:About the quotation of IC BOM?
A1:The company has the procurement channels of original integrated circuit manufacturers at home and abroad and a professional product solution analysis team to select high-quality, low-cost electronic components for customers. Q2:Quotation for PCB and PCBA solutions?
A2: The company's professional team will analyze the application range of the PCB and PCBA solutions provided by the customer and the parameter requirements of each electronic component, and ultimately provide customers with high-quality and low-cost quotation solutions.
Q3:About chip design to finished product?
A3: We have a complete set of wafer design, wafer production, wafer testing, IC packaging and integration,and IC product inspection services.
Q4:Does our company have a minimum order quantity (MOQ) requirement?
A4: No, we do not have MOQ requirement, we can support your projects starting from prototypes to mass productions.
Q5:How to ensure that customer information is not leaked?
A5: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
Texas Instruments SN74H164N Electronic ic Components Chip FP Ball Grid Array integratedated Circuit For Mobile TI-SN74H164N

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